BM20B(0.8)-20DP-0.4V(51) Hirose Connector

Board to Board & Mezzanine Connectors 20P DR HDR B2B/B2FPC 0.8mm H 0.4mm P VSM
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 1.81 EUR |
10+ | 1.27 EUR |
100+ | 1.10 EUR |
500+ | 1.04 EUR |
1000+ | 0.98 EUR |
2500+ | 0.90 EUR |
8000+ | 0.89 EUR |
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Technische Details BM20B(0.8)-20DP-0.4V(51) Hirose Connector
Description: CONN HDR 20POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.016" (0.40mm), Height Above Board: 0.026" (0.65mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.8)-20DP-0.4V(51) nach Preis ab 0.96 EUR bis 2.31 EUR
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BM20B(0.8)-20DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.016" (0.40mm) Height Above Board: 0.026" (0.65mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 7100 Stücke: Lieferzeit 10-14 Tag (e) |
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BM20B(0.8)-20DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.016" (0.40mm) Height Above Board: 0.026" (0.65mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |