BM20B(0.8)-24DS-0.4V(51) Hirose Connector

Board to Board & Mezzanine Connectors 24P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM
auf Bestellung 7187 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 1.95 EUR |
10+ | 1.39 EUR |
100+ | 1.20 EUR |
500+ | 1.13 EUR |
1000+ | 1.06 EUR |
2500+ | 0.98 EUR |
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Produktbewertung abgeben
Technische Details BM20B(0.8)-24DS-0.4V(51) Hirose Connector
Description: CONN RCPT 24POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 24, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.8)-24DS-0.4V(51) nach Preis ab 1.04 EUR bis 2.50 EUR
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BM20B(0.8)-24DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 2944 Stücke: Lieferzeit 10-14 Tag (e) |
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BM20B(0.8)-24DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |