BM20B(0.8)-30DS-0.4V(51) Hirose
| Anzahl | Privatkunde |
|---|---|
| 135+ | 1.3 EUR |
| 200+ | 1.26 EUR |
| 500+ | 1.08 EUR |
| 1000+ | 1 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM20B(0.8)-30DS-0.4V(51) Hirose
Description: CONN RCPT 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.8)-30DS-0.4V(51) nach Preis ab 1.15 EUR bis 2.37 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
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BM20B(0.8)-30DS-0.4V(51) | Hirose Electric Co Ltd |
 Description: CONN RCPT 30POS SMD GOLDFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 3734 Stücke: Lieferzeit 10-14 Tag (e) |
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BM20B(0.8)-30DS-0.4V(51) | Hirose Connector |
Board to Board & Mezzanine Connectors 30P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM |
auf Bestellung 7220 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM20B(0.8)-30DS-0.4V(51) |
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Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 3734 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.2 EUR |
| 12+ | 1.87 EUR |
| 25+ | 1.75 EUR |
| 50+ | 1.67 EUR |
| 100+ | 1.58 EUR |
| 250+ | 1.49 EUR |
| 500+ | 1.42 EUR |
| 1000+ | 1.34 EUR |
| 2500+ | 1.3 EUR |
| BM20B(0.8)-30DS-0.4V(51) |
|
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 30P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM
Board to Board & Mezzanine Connectors 30P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM
auf Bestellung 7220 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.37 EUR |
| 10+ | 2.01 EUR |
| 100+ | 1.82 EUR |
| 500+ | 1.49 EUR |
| 1000+ | 1.32 EUR |
| 2500+ | 1.2 EUR |
| 5000+ | 1.15 EUR |