-30DS-0.4V(51).jpg "BM20B(0.8)-30DS-0.4V(51)")
BM20B(0.8)-30DS-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 1526 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 2.01 EUR |
| 11+ | 1.69 EUR |
| 25+ | 1.62 EUR |
| 50+ | 1.59 EUR |
| 100+ | 1.52 EUR |
| 250+ | 1.38 EUR |
| 500+ | 1.24 EUR |
| 1000+ | 1.1 EUR |
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Technische Details BM20B(0.8)-30DS-0.4V(51) Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM20B(0.8)-30DS-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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BM20B(0.8)-30DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM20B(0.8)-30DS-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 30P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSMT |
Produkt ist nicht verfügbar |