BM23FR0.6-12DS-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 12POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 12
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10000+ | 0.58 EUR |
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Technische Details BM23FR0.6-12DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 12POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 12, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM23FR0.6-12DS-0.35V(51) nach Preis ab 0.61 EUR bis 1.27 EUR
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BM23FR0.6-12DS-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 12P RCPT STRGHT SMT SIGNAL ONLY |
auf Bestellung 11935 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23FR0.6-12DS-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 12POS SMD GOLD Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 12 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23FR0.6-12DS-0.35V(51) | Hersteller : HIROSE |
BM23FR0612DS035V51 Other Hirose Connectors |
Produkt ist nicht verfügbar |