BM23FR0.6-24DS-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 24POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 9933 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11+ | 1.69 EUR |
| 13+ | 1.43 EUR |
| 25+ | 1.37 EUR |
| 50+ | 1.34 EUR |
| 100+ | 1.28 EUR |
| 250+ | 1.17 EUR |
| 500+ | 1.05 EUR |
| 1000+ | 0.93 EUR |
| 2500+ | 0.85 EUR |
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Produktbewertung abgeben
Technische Details BM23FR0.6-24DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 24POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 24, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM23FR0.6-24DS-0.35V(51)
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BM23FR0.6-24DS-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 24POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM23FR0.6-24DS-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |