BM23FR0.8-18DS-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 18POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 18
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
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Technische Details BM23FR0.8-18DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 18POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.014" (0.35mm), Number of Positions: 18, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23FR0.8-18DS-0.35V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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BM23FR0.8-18DS-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 18P RCPT STRGHT SMT SIGNAL ONLY |
Produkt ist nicht verfügbar |