BM23FR0.8-18DS-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 18POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23FR0.8-18DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 18POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 18, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM23FR0.8-18DS-0.35V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
BM23FR0.8-18DS-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 18P RCPT STRGHT SMT SIGNAL ONLY |
Produkt ist nicht verfügbar |