BM23FR0.8-60DP-0.35V(51) Hirose Electric Co Ltd

Description: CONN HDR 60POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
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Technische Details BM23FR0.8-60DP-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR 60POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM23FR0.8-60DP-0.35V(51)
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BM23FR0.8-60DP-0.35V(51) | Hersteller : Hirose Connector |
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