BM23PF0.8-30DS-0.35V(895) HIROSE
Hersteller: HIROSE
Category: Board-to-board connectors
Description: Connector: PCB to PCB; socket; female; PIN: 30; BM23PF; vertical
Current rating: 0.3A
Manufacturer series: BM23PF
Mechanical mounting: on PCBs
Type of connector: PCB to PCB
Electrical mounting: SMT
Connector: socket
Spatial orientation: vertical
Contacts pitch: 0.35mm
Number of pins: 30
Mechanical durability: 10 cycles
Kind of connector: female
Contact plating: gold-plated
| Anzahl | Preis |
|---|---|
| 57+ | 1.27 EUR |
| 66+ | 1.09 EUR |
| 71+ | 1.02 EUR |
| 74+ | 0.97 EUR |
| 100+ | 0.92 EUR |
| 250+ | 0.87 EUR |
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Produktbewertung abgeben
Technische Details BM23PF0.8-30DS-0.35V(895) HIROSE
Category: Board-to-board connectors, Description: Connector: PCB to PCB; socket; female; PIN: 30; BM23PF; vertical, Current rating: 0.3A, Manufacturer series: BM23PF, Mechanical mounting: on PCBs, Type of connector: PCB to PCB, Electrical mounting: SMT, Connector: socket, Spatial orientation: vertical, Contacts pitch: 0.35mm, Number of pins: 30, Mechanical durability: 10 cycles, Kind of connector: female, Contact plating: gold-plated.
Weitere Produktangebote BM23PF0.8-30DS-0.35V(895) nach Preis ab 0.97 EUR bis 1.88 EUR
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BM23PF0.8-30DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLDPackaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 17000 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-30DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLDPackaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 18522 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-30DS-0.35V(895) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER |
auf Bestellung 2854 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | Hersteller : Hirose |
BM23PF0.8-30DS-0.35V(895) |
auf Bestellung 809 Stücke: Lieferzeit 14-21 Tag (e) |
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