BM23PF0.8-30DS-0.35V(895) HIROSE
Hersteller: HIROSE
Category: Board-to-board connectors
Description: Connector: PCB to PCB; socket; female; PIN: 30; BM23PF; vertical
Number of pins: 30
Manufacturer series: BM23PF
Contacts pitch: 0.35mm
Current rating: 0.3A
Mechanical durability: 10 cycles
Mechanical mounting: on PCBs
Electrical mounting: SMT
Type of connector: PCB to PCB
Kind of connector: female
Connector: socket
Contact plating: gold-plated
Spatial orientation: vertical
| Anzahl | Privatkunde |
|---|---|
| 57+ | 1.51 EUR |
| 66+ | 1.3 EUR |
| 71+ | 1.21 EUR |
| 74+ | 1.15 EUR |
| 100+ | 1.09 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23PF0.8-30DS-0.35V(895) HIROSE
Category: Board-to-board connectors, Description: Connector: PCB to PCB; socket; female; PIN: 30; BM23PF; vertical, Number of pins: 30, Manufacturer series: BM23PF, Contacts pitch: 0.35mm, Current rating: 0.3A, Mechanical durability: 10 cycles, Mechanical mounting: on PCBs, Electrical mounting: SMT, Type of connector: PCB to PCB, Kind of connector: female, Connector: socket, Contact plating: gold-plated, Spatial orientation: vertical.
Weitere Produktangebote BM23PF0.8-30DS-0.35V(895) nach Preis ab 1.15 EUR bis 2.24 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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BM23PF0.8-30DS-0.35V(895) | Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 17000 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-30DS-0.35V(895) | Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 30 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 18522 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-30DS-0.35V(895) | Hirose Connector |
Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER |
auf Bestellung 5892 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | Hirose |
BM23PF0.8-30DS-0.35V(895) |
auf Bestellung 809 Stücke: Lieferzeit 14-21 Tag (e) |
|
| BM23PF0.8-30DS-0.35V(895) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
Description: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 17000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 1.37 EUR |
| 2000+ | 1.3 EUR |
| 3000+ | 1.26 EUR |
| 5000+ | 1.21 EUR |
| 7000+ | 1.19 EUR |
| 10000+ | 1.15 EUR |
| BM23PF0.8-30DS-0.35V(895) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Description: CONN RCPT 30POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 30
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 18522 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.23 EUR |
| 12+ | 1.89 EUR |
| 25+ | 1.77 EUR |
| 50+ | 1.69 EUR |
| 100+ | 1.61 EUR |
| 250+ | 1.5 EUR |
| 500+ | 1.43 EUR |
| BM23PF0.8-30DS-0.35V(895) |
|
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER
Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER
auf Bestellung 5892 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.24 EUR |
| 10+ | 1.92 EUR |
| 25+ | 1.7 EUR |
| 100+ | 1.62 EUR |
| 250+ | 1.54 EUR |
| 500+ | 1.52 EUR |
| 1000+ | 1.46 EUR |
| BM23PF0.8-30DS-0.35V(895) |
|
Hersteller: Hirose
BM23PF0.8-30DS-0.35V(895)
BM23PF0.8-30DS-0.35V(895)
auf Bestellung 809 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 93+ | 2.07 EUR |