.jpg "BM23PF0.8-40DP-0.35V(51)")
BM23PF0.8-40DP-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 40POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 9487 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 3.07 EUR |
| 11+ | 2.58 EUR |
| 25+ | 2.48 EUR |
| 50+ | 2.42 EUR |
| 100+ | 2.32 EUR |
| 250+ | 2.11 EUR |
| 500+ | 1.9 EUR |
| 1000+ | 1.69 EUR |
| 2500+ | 1.53 EUR |
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Technische Details BM23PF0.8-40DP-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR 40POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40, Pitch: 0.014" (0.35mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-40DP-0.35V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
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BM23PF0.8-40DP-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 40POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM23PF0.8-40DP-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 40P HDR STRGHT SMT HYBRID W/POWER |
Produkt ist nicht verfügbar |