
BM23PF0.8-40DS-0.35V(895) Hirose Connector

Board to Board & Mezzanine Connectors 40P RCPT STRGHT SMT HYBRID W/POWER
auf Bestellung 6132 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 2.48 EUR |
10+ | 1.76 EUR |
100+ | 1.51 EUR |
500+ | 1.42 EUR |
1000+ | 1.30 EUR |
2000+ | 1.26 EUR |
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Technische Details BM23PF0.8-40DS-0.35V(895) Hirose Connector
Description: CONN RCPT 40POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM23PF0.8-40DS-0.35V(895) nach Preis ab 1.71 EUR bis 2.64 EUR
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BM23PF0.8-40DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 1100 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-40DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
Produkt ist nicht verfügbar |