BM23PF0.8-54DS-0.35V(895) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 54POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 54
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23PF0.8-54DS-0.35V(895) Hirose Electric Co Ltd
Description: CONN RCPT 54POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.014" (0.35mm), Number of Positions: 54, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23PF0.8-54DS-0.35V(895) nach Preis ab 1.74 EUR bis 3.25 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
BM23PF0.8-54DS-0.35V(895) | Hirose Electric Co Ltd |
Description: CONN RCPT 54POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 54 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 2044 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
BM23PF0.8-54DS-0.35V(895) | Hirose Connector |
Board to Board & Mezzanine Connectors 54P RCPT STRGHT SMT HYBRID W/POWER |
auf Bestellung 805 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BM23PF0.8-54DS-0.35V(895) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 54POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 54
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Description: CONN RCPT 54POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 54
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 2044 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.2 EUR |
| 10+ | 2.62 EUR |
| 25+ | 2.42 EUR |
| 50+ | 2.27 EUR |
| 100+ | 2.14 EUR |
| 250+ | 1.98 EUR |
| 500+ | 1.86 EUR |
| BM23PF0.8-54DS-0.35V(895) |
|
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 54P RCPT STRGHT SMT HYBRID W/POWER
Board to Board & Mezzanine Connectors 54P RCPT STRGHT SMT HYBRID W/POWER
auf Bestellung 805 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 3.25 EUR |
| 10+ | 2.64 EUR |
| 25+ | 2.45 EUR |
| 50+ | 2.31 EUR |
| 100+ | 2.15 EUR |
| 250+ | 2 EUR |
| 1000+ | 1.74 EUR |