BM23PF0.8-54DS-0.35V(895) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 54POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 54
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 1000+ | 1.66 EUR |
| 2000+ | 1.58 EUR |
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Technische Details BM23PF0.8-54DS-0.35V(895) Hirose Electric Co Ltd
Description: CONN RCPT 54POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.014" (0.35mm), Number of Positions: 54, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23PF0.8-54DS-0.35V(895) nach Preis ab 1.46 EUR bis 2.73 EUR
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BM23PF0.8-54DS-0.35V(895) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 54POS SMD GOLDNumber of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 54 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 2044 Stücke: Lieferzeit 10-14 Tag (e) |
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BM23PF0.8-54DS-0.35V(895) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 54P RCPT STRGHT SMT HYBRID W/POWER |
auf Bestellung 805 Stücke: Lieferzeit 10-14 Tag (e) |
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