BM23PF0.8-64DS-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD
Number of Rows: 2
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.014" (0.35mm)
Number of Positions: 64
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 10000+ | 0.93 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM23PF0.8-64DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 60POS SMD GOLD, Number of Rows: 2, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.014" (0.35mm), Number of Positions: 64, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM23PF0.8-64DS-0.35V(51) nach Preis ab 1.11 EUR bis 1.94 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
BM23PF0.8-64DS-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 60POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 64 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 17433 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||||
 |
BM23PF0.8-64DS-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |