BM28B0.6-10DP/2-0.35V(53) Hirose Connector
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.68 EUR |
| 10+ | 1.43 EUR |
| 25+ | 1.27 EUR |
| 100+ | 1.21 EUR |
| 500+ | 1.15 EUR |
| 1000+ | 1.14 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM28B0.6-10DP/2-0.35V(53) Hirose Connector
Description: CONN HDR 10POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.014" (0.35mm), Height Above Board: 0.018" (0.46mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM28B0.6-10DP/2-0.35V(53)
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
BM28B0.6-10DP/2-0.35V(53) | Hirose Electric Co Ltd |
Description: CONN HDR 10POS SMD GOLDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.014" (0.35mm) Height Above Board: 0.018" (0.46mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
BM28B0.6-10DP/2-0.35V(53) | Hirose Electric Co Ltd |
Description: CONN HDR 10POS SMD GOLDFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.014" (0.35mm) Height Above Board: 0.018" (0.46mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BM28B0.6-10DP/2-0.35V(53) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BM28B0.6-10DP/2-0.35V(53) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN HDR 10POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH



