BM28B0.6-60DP/2-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 62 (60 + 2 Power)
Pitch: 0.014" (0.35mm)
Height Above Board: 0.018" (0.46mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 19126 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.92 EUR |
| 11+ | 1.64 EUR |
| 25+ | 1.53 EUR |
| 50+ | 1.46 EUR |
| 100+ | 1.39 EUR |
| 250+ | 1.30 EUR |
| 500+ | 1.24 EUR |
| 1000+ | 1.18 EUR |
| 2500+ | 1.14 EUR |
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Technische Details BM28B0.6-60DP/2-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 62 (60 + 2 Power), Pitch: 0.014" (0.35mm), Height Above Board: 0.018" (0.46mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM28B0.6-60DP/2-0.35V(51)
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BM28B0.6-60DP/2-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 62 (60 + 2 Power) Pitch: 0.014" (0.35mm) Height Above Board: 0.018" (0.46mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM28B0.6-60DP/2-0.35V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |