
BM28B0.6-6DS/2-0.35V(51) Hirose Electric Co Ltd

Description: CONN RCPT SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 10377 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
18+ | 0.99 EUR |
22+ | 0.84 EUR |
25+ | 0.78 EUR |
50+ | 0.75 EUR |
100+ | 0.71 EUR |
250+ | 0.67 EUR |
500+ | 0.63 EUR |
1000+ | 0.60 EUR |
2500+ | 0.57 EUR |
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Produktbewertung abgeben
Technische Details BM28B0.6-6DS/2-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 6, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM28B0.6-6DS/2-0.35V(51) nach Preis ab 0.50 EUR bis 1.07 EUR
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BM28B0.6-6DS/2-0.35V(51) | Hersteller : Hirose Connector |
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auf Bestellung 18938 Stücke: Lieferzeit 10-14 Tag (e) |
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BM28B0.6-6DS/2-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 6 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |