BM54F3.0-30DP-0.4V(51) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors Plug, 0.4mm pitch, 30pos., SMT, 0.3A
| Anzahl | Preis |
|---|---|
| 2+ | 2.69 EUR |
| 10+ | 2.31 EUR |
| 25+ | 2.04 EUR |
| 100+ | 1.95 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.8 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM54F3.0-30DP-0.4V(51) Hirose Connector
Description: Interconnect Rectangular, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Plug, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.104" (2.65mm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote BM54F3.0-30DP-0.4V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
BM54F3.0-30DP-0.4V(51) | Hirose Electric Co Ltd |
Description: Interconnect RectangularFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.104" (2.65mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
BM54F3.0-30DP-0.4V(51) | Hirose Electric Co Ltd |
Description: Interconnect RectangularFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.104" (2.65mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BM54F3.0-30DP-0.4V(51) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.104" (2.65mm)
Mated Stacking Heights: 3mm
Number of Rows: 2
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.104" (2.65mm)
Mated Stacking Heights: 3mm
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BM54F3.0-30DP-0.4V(51) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.104" (2.65mm)
Mated Stacking Heights: 3mm
Number of Rows: 2
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.104" (2.65mm)
Mated Stacking Heights: 3mm
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH

