BM54F3.0-30DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: Interconnect Rectangular
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.104" (2.65mm)
Mated Stacking Heights: 3mm
Number of Rows: 2
auf Bestellung 2968 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.5 EUR |
| 10+ | 2.12 EUR |
| 25+ | 1.99 EUR |
| 50+ | 1.89 EUR |
| 100+ | 1.8 EUR |
| 250+ | 1.69 EUR |
| 500+ | 1.61 EUR |
| 1000+ | 1.53 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM54F3.0-30DP-0.4V(51) Hirose Electric Co Ltd
Description: Interconnect Rectangular, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Plug, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.104" (2.65mm), Mated Stacking Heights: 3mm, Number of Rows: 2.
Weitere Produktangebote BM54F3.0-30DP-0.4V(51) nach Preis ab 1.9 EUR bis 2.92 EUR
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BM54F3.0-30DP-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors Plug, 0.4mm pitch, 30pos., SMT, 0.3A |
auf Bestellung 3645 Stücke: Lieferzeit 10-14 Tag (e) |
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BM54F3.0-30DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: Interconnect Rectangular Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.104" (2.65mm) Mated Stacking Heights: 3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |