BM57B0.6-10DP/2-0.3V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 0.3MM SMD 10POS + 2PWR
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.012" (0.30mm)
Height Above Board: 0.019" (0.48mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN HDR 0.3MM SMD 10POS + 2PWR
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 10
Pitch: 0.012" (0.30mm)
Height Above Board: 0.019" (0.48mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 896 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
11+ | 1.74 EUR |
12+ | 1.49 EUR |
25+ | 1.42 EUR |
50+ | 1.39 EUR |
100+ | 1.33 EUR |
250+ | 1.21 EUR |
500+ | 1.09 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM57B0.6-10DP/2-0.3V(53) Hirose Electric Co Ltd
Description: CONN HDR 0.3MM SMD 10POS + 2PWR, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.012" (0.30mm), Height Above Board: 0.019" (0.48mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM57B0.6-10DP/2-0.3V(53)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
BM57B0.6-10DP/2-0.3V(53) | Hersteller : HIROSE |
Category: Other Hirose Connectors Description: BM57B0.6-10DP/2-0.3V(53) Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
||
BM57B0.6-10DP/2-0.3V(53) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 0.3MM SMD 10POS + 2PWR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.012" (0.30mm) Height Above Board: 0.019" (0.48mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
||
BM57B0.6-10DP/2-0.3V(53) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors Header.3mm.6mm Height 1.9mm WidthLow-Profile Hybrid |
Produkt ist nicht verfügbar |
||
BM57B0.6-10DP/2-0.3V(53) | Hersteller : HIROSE |
Category: Other Hirose Connectors Description: BM57B0.6-10DP/2-0.3V(53) |
Produkt ist nicht verfügbar |