BM57B0.6-10DS/2-0.3V(51) Hirose Connector
Hersteller: Hirose ConnectorBoard to Board & Mezzanine Connectors Rcpt.3mm .6mm Height 1.9mm WidthLow-Profile Hybrid
auf Bestellung 18345 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 1.27 EUR |
| 10+ | 1.09 EUR |
| 25+ | 1.04 EUR |
| 100+ | 0.98 EUR |
| 250+ | 0.89 EUR |
| 500+ | 0.8 EUR |
| 1000+ | 0.74 EUR |
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Technische Details BM57B0.6-10DS/2-0.3V(51) Hirose Connector
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 10, Pitch: 0.012" (0.30mm), Height Above Board: 0.021" (0.55mm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM57B0.6-10DS/2-0.3V(51)
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BM57B0.6-10DS/2-0.3V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.012" (0.30mm) Height Above Board: 0.021" (0.55mm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM57B0.6-10DS/2-0.3V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 10 Pitch: 0.012" (0.30mm) Height Above Board: 0.021" (0.55mm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |