BM57B0.6-10DS/2-0.3V(51) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors Rcpt.3mm .6mm Height 1.9mm WidthLow-Profile Hybrid
| Anzahl | Preis |
|---|---|
| 3+ | 1.27 EUR |
| 10+ | 1.09 EUR |
| 25+ | 1.04 EUR |
| 100+ | 0.98 EUR |
| 250+ | 0.89 EUR |
| 500+ | 0.8 EUR |
| 1000+ | 0.74 EUR |
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Technische Details BM57B0.6-10DS/2-0.3V(51) Hirose Connector
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR), Mated Stacking Heights: 0.6mm, Height Above Board: 0.021" (0.55mm), Pitch: 0.012" (0.30mm), Number of Positions: 10, Number of Rows: 2.
Weitere Produktangebote BM57B0.6-10DS/2-0.3V(51)
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BM57B0.6-10DS/2-0.3V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) Mated Stacking Heights: 0.6mm Height Above Board: 0.021" (0.55mm) Pitch: 0.012" (0.30mm) Number of Positions: 10 Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM57B0.6-10DS/2-0.3V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Number of Rows: 2 Mated Stacking Heights: 0.6mm Height Above Board: 0.021" (0.55mm) Pitch: 0.012" (0.30mm) Number of Positions: 10 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |