BM57B0.6-10DS/2-0.3V(51) Hirose Connector
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors Rcpt.3mm .6mm Height 1.9mm WidthLow-Profile Hybrid
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.51 EUR |
| 10+ | 1.3 EUR |
| 25+ | 1.24 EUR |
| 100+ | 1.17 EUR |
| 250+ | 1.06 EUR |
| 500+ | 0.95 EUR |
| 1000+ | 0.88 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM57B0.6-10DS/2-0.3V(51) Hirose Connector
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR), Mated Stacking Heights: 0.6mm, Height Above Board: 0.021" (0.55mm), Pitch: 0.012" (0.30mm), Number of Positions: 10, Number of Rows: 2.
Weitere Produktangebote BM57B0.6-10DS/2-0.3V(51)
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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BM57B0.6-10DS/2-0.3V(51) | Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) Mated Stacking Heights: 0.6mm Height Above Board: 0.021" (0.55mm) Pitch: 0.012" (0.30mm) Number of Positions: 10 Number of Rows: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 20000 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
|
BM57B0.6-10DS/2-0.3V(51) | Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR Number of Rows: 2 Mated Stacking Heights: 0.6mm Height Above Board: 0.021" (0.55mm) Pitch: 0.012" (0.30mm) Number of Positions: 10 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BM57B0.6-10DS/2-0.3V(51) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
Mated Stacking Heights: 0.6mm
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Number of Rows: 2
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
Mated Stacking Heights: 0.6mm
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 20000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BM57B0.6-10DS/2-0.3V(51) |
|
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH