BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Anzahl | Preis |
|---|---|
| 8+ | 2.34 EUR |
| 10+ | 1.78 EUR |
| 25+ | 1.6 EUR |
| 50+ | 1.48 EUR |
| 100+ | 1.37 EUR |
| 250+ | 1.24 EUR |
| 500+ | 1.15 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM57B0.6-10DS/2-0.3V(53) Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR, Number of Rows: 2, Mated Stacking Heights: 0.6mm, Contact Finish Thickness: 1.97µin (0.050µm), Height Above Board: 0.021" (0.55mm), Pitch: 0.012" (0.30mm), Number of Positions: 10, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM57B0.6-10DS/2-0.3V(53)
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
|
BM57B0.6-10DS/2-0.3V(53) | Hirose Electric Co Ltd |
Description: CONN RCPT 0.3MM SMD 10POS + 2PWRNumber of Rows: 2 Mated Stacking Heights: 0.6mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.021" (0.55mm) Pitch: 0.012" (0.30mm) Number of Positions: 10 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
BM57B0.6-10DS/2-0.3V(53) | Hirose Connector |
Board to Board & Mezzanine Connectors Rcpt .3mm.6mm Height 1.9mm WidthLow-Profile Hybrid |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH |
| BM57B0.6-10DS/2-0.3V(53) |
![]() |
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
Description: CONN RCPT 0.3MM SMD 10POS + 2PWR
Number of Rows: 2
Mated Stacking Heights: 0.6mm
Contact Finish Thickness: 1.97µin (0.050µm)
Height Above Board: 0.021" (0.55mm)
Pitch: 0.012" (0.30mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BM57B0.6-10DS/2-0.3V(53) |
![]() |
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors Rcpt .3mm.6mm Height 1.9mm WidthLow-Profile Hybrid
Board to Board & Mezzanine Connectors Rcpt .3mm.6mm Height 1.9mm WidthLow-Profile Hybrid
Produkt ist nicht verfügbar
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen
Stück im Wert von UAH


