BSPQ000603041N7B00 Pulse Electronics
Hersteller: Pulse Electronics
Description: FIXED IND CHIP CERM 1.7NH 800MA
Frequency - Self Resonant: 10GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 70mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Cut Tape (CT)
Current Rating (Amps): 800 mA
Inductance: 1.7 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
| Anzahl | Preis |
|---|---|
| 112+ | 0.16 EUR |
| 278+ | 0.063 EUR |
| 302+ | 0.058 EUR |
| 341+ | 0.052 EUR |
| 390+ | 0.045 EUR |
| 410+ | 0.043 EUR |
| 500+ | 0.04 EUR |
| 1000+ | 0.031 EUR |
| 2500+ | 0.029 EUR |
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Technische Details BSPQ000603041N7B00 Pulse Electronics
Description: FIXED IND CHIP CERM 1.7NH 800MA, Packaging: Tape & Reel (TR), Current Rating (Amps): 800 mA, Inductance: 1.7 nH, Part Status: Active, Height - Seated (Max): 0.017" (0.43mm), Supplier Device Package: 0201, Inductance Frequency - Test: 500 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 10GHz, Q @ Freq: 20 @ 500MHz, DC Resistance (DCR): 70mOhm Max, Operating Temperature: -55°C ~ 125°C, Type: Thick Film, Shielding: Unshielded, Mounting Type: Surface Mount, Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Package / Case: 0201 (0603 Metric), Tolerance: ±0.1nH.
Weitere Produktangebote BSPQ000603041N7B00
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BSPQ000603041N7B00 | Pulse Electronics |
Description: FIXED IND CHIP CERM 1.7NH 800MA Packaging: Tape & Reel (TR) Current Rating (Amps): 800 mA Inductance: 1.7 nH Part Status: Active Height - Seated (Max): 0.017" (0.43mm) Supplier Device Package: 0201 Inductance Frequency - Test: 500 MHz Material - Core: Ceramic Frequency - Self Resonant: 10GHz Q @ Freq: 20 @ 500MHz DC Resistance (DCR): 70mOhm Max Operating Temperature: -55°C ~ 125°C Type: Thick Film Shielding: Unshielded Mounting Type: Surface Mount Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Package / Case: 0201 (0603 Metric) Tolerance: ±0.1nH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BSPQ000603041N7B00 |
|
Hersteller: Pulse Electronics
Description: FIXED IND CHIP CERM 1.7NH 800MA
Packaging: Tape & Reel (TR)
Current Rating (Amps): 800 mA
Inductance: 1.7 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 10GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 70mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Description: FIXED IND CHIP CERM 1.7NH 800MA
Packaging: Tape & Reel (TR)
Current Rating (Amps): 800 mA
Inductance: 1.7 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 10GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 70mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH