BSPQ000603041N9B00 Pulse Electronics
Hersteller: Pulse Electronics
Description: FIXED IND CHIP CERM 1.9NH 600MA
Current Rating (Amps): 600 mA
Inductance: 1.9 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 10GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 120mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Tape & Reel (TR)
Produktrezensionen
Produktbewertung abgeben
Technische Details BSPQ000603041N9B00 Pulse Electronics
Description: FIXED IND CHIP CERM 1.9NH 600MA, Current Rating (Amps): 600 mA, Inductance: 1.9 nH, Part Status: Active, Height - Seated (Max): 0.017" (0.43mm), Supplier Device Package: 0201, Inductance Frequency - Test: 500 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 10GHz, Q @ Freq: 20 @ 500MHz, DC Resistance (DCR): 120mOhm Max, Operating Temperature: -55°C ~ 125°C, Type: Thick Film, Shielding: Unshielded, Mounting Type: Surface Mount, Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Package / Case: 0201 (0603 Metric), Tolerance: ±0.1nH, Packaging: Tape & Reel (TR).
Weitere Produktangebote BSPQ000603041N9B00 nach Preis ab 0.095 EUR bis 0.25 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
BSPQ000603041N9B00 | Pulse Electronics |
Description: FIXED IND CHIP CERM 1.9NH 600MA Current Rating (Amps): 600 mA Inductance: 1.9 nH Part Status: Active Height - Seated (Max): 0.017" (0.43mm) Supplier Device Package: 0201 Inductance Frequency - Test: 500 MHz Material - Core: Ceramic Frequency - Self Resonant: 10GHz Q @ Freq: 20 @ 500MHz DC Resistance (DCR): 120mOhm Max Operating Temperature: -55°C ~ 125°C Type: Thick Film Shielding: Unshielded Mounting Type: Surface Mount Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Package / Case: 0201 (0603 Metric) Tolerance: ±0.1nH Packaging: Cut Tape (CT) |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BSPQ000603041N9B00 |
|
Hersteller: Pulse Electronics
Description: FIXED IND CHIP CERM 1.9NH 600MA
Current Rating (Amps): 600 mA
Inductance: 1.9 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 10GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 120mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Cut Tape (CT)
Description: FIXED IND CHIP CERM 1.9NH 600MA
Current Rating (Amps): 600 mA
Inductance: 1.9 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 10GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 120mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Cut Tape (CT)
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 84+ | 0.25 EUR |
| 102+ | 0.2 EUR |
| 111+ | 0.19 EUR |
| 125+ | 0.17 EUR |
| 143+ | 0.14 EUR |
| 500+ | 0.13 EUR |
| 1000+ | 0.1 EUR |
| 2500+ | 0.095 EUR |