BSPQ000603042N3B00 Chilisin Electronics
Hersteller: Chilisin Electronics
Description: FIXED IND CHIP CERM 2.3NH 600MA
Packaging: Cut Tape (CT)
Tolerance: ±0.1nH
Package / Case: 0201 (0603 Metric)
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Thick Film
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 120mOhm Max
Q @ Freq: 20 @ 500MHz
Frequency - Self Resonant: 9GHz
Material - Core: Ceramic
Inductance Frequency - Test: 500 MHz
Supplier Device Package: 0201
Height - Seated (Max): 0.017" (0.43mm)
Inductance: 2.3 nH
Current Rating (Amps): 600 mA
Description: FIXED IND CHIP CERM 2.3NH 600MA
Packaging: Cut Tape (CT)
Tolerance: ±0.1nH
Package / Case: 0201 (0603 Metric)
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Thick Film
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 120mOhm Max
Q @ Freq: 20 @ 500MHz
Frequency - Self Resonant: 9GHz
Material - Core: Ceramic
Inductance Frequency - Test: 500 MHz
Supplier Device Package: 0201
Height - Seated (Max): 0.017" (0.43mm)
Inductance: 2.3 nH
Current Rating (Amps): 600 mA
auf Bestellung 14853 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 77+ | 0.23 EUR |
| 89+ | 0.20 EUR |
| 105+ | 0.17 EUR |
| 118+ | 0.15 EUR |
| 129+ | 0.14 EUR |
| 250+ | 0.12 EUR |
| 1000+ | 0.09 EUR |
| 2500+ | 0.09 EUR |
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Technische Details BSPQ000603042N3B00 Chilisin Electronics
Description: FIXED IND CHIP CERM 2.3NH 600MA, Packaging: Tape & Reel (TR), Tolerance: ±0.1nH, Package / Case: 0201 (0603 Metric), Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Thick Film, Operating Temperature: -55°C ~ 125°C, DC Resistance (DCR): 120mOhm Max, Q @ Freq: 20 @ 500MHz, Frequency - Self Resonant: 9GHz, Material - Core: Ceramic, Inductance Frequency - Test: 500 MHz, Supplier Device Package: 0201, Height - Seated (Max): 0.017" (0.43mm), Inductance: 2.3 nH, Current Rating (Amps): 600 mA.
Weitere Produktangebote BSPQ000603042N3B00
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| BSPQ000603042N3B00 | Hersteller : Chilisin Electronics |
Description: FIXED IND CHIP CERM 2.3NH 600MA Packaging: Tape & Reel (TR) Tolerance: ±0.1nH Package / Case: 0201 (0603 Metric) Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Thick Film Operating Temperature: -55°C ~ 125°C DC Resistance (DCR): 120mOhm Max Q @ Freq: 20 @ 500MHz Frequency - Self Resonant: 9GHz Material - Core: Ceramic Inductance Frequency - Test: 500 MHz Supplier Device Package: 0201 Height - Seated (Max): 0.017" (0.43mm) Inductance: 2.3 nH Current Rating (Amps): 600 mA |
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