BSPQ000603042N9B00 Pulse Electronics
Hersteller: Pulse Electronics
Description: FIXED IND CHIP CERM 2.9NH 600MA
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 8GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 120mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Cut Tape (CT)
Current Rating (Amps): 600 mA
Inductance: 2.9 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
| Anzahl | Preis |
|---|---|
| 112+ | 0.16 EUR |
| 271+ | 0.065 EUR |
| 291+ | 0.061 EUR |
| 327+ | 0.054 EUR |
| 375+ | 0.047 EUR |
| 395+ | 0.045 EUR |
| 500+ | 0.042 EUR |
| 1000+ | 0.032 EUR |
| 2500+ | 0.03 EUR |
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Technische Details BSPQ000603042N9B00 Pulse Electronics
Description: FIXED IND CHIP CERM 2.9NH 600MA, Current Rating (Amps): 600 mA, Inductance: 2.9 nH, Part Status: Active, Height - Seated (Max): 0.017" (0.43mm), Supplier Device Package: 0201, Inductance Frequency - Test: 500 MHz, Material - Core: Ceramic, Frequency - Self Resonant: 8GHz, Q @ Freq: 20 @ 500MHz, DC Resistance (DCR): 120mOhm Max, Operating Temperature: -55°C ~ 125°C, Type: Thick Film, Shielding: Unshielded, Mounting Type: Surface Mount, Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Package / Case: 0201 (0603 Metric), Tolerance: ±0.1nH, Packaging: Tape & Reel (TR).
Weitere Produktangebote BSPQ000603042N9B00
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BSPQ000603042N9B00 | Pulse Electronics |
Description: FIXED IND CHIP CERM 2.9NH 600MA Current Rating (Amps): 600 mA Inductance: 2.9 nH Part Status: Active Height - Seated (Max): 0.017" (0.43mm) Supplier Device Package: 0201 Inductance Frequency - Test: 500 MHz Material - Core: Ceramic Frequency - Self Resonant: 8GHz Q @ Freq: 20 @ 500MHz DC Resistance (DCR): 120mOhm Max Operating Temperature: -55°C ~ 125°C Type: Thick Film Shielding: Unshielded Mounting Type: Surface Mount Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Package / Case: 0201 (0603 Metric) Tolerance: ±0.1nH Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BSPQ000603042N9B00 |
|
Hersteller: Pulse Electronics
Description: FIXED IND CHIP CERM 2.9NH 600MA
Current Rating (Amps): 600 mA
Inductance: 2.9 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 8GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 120mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Tape & Reel (TR)
Description: FIXED IND CHIP CERM 2.9NH 600MA
Current Rating (Amps): 600 mA
Inductance: 2.9 nH
Part Status: Active
Height - Seated (Max): 0.017" (0.43mm)
Supplier Device Package: 0201
Inductance Frequency - Test: 500 MHz
Material - Core: Ceramic
Frequency - Self Resonant: 8GHz
Q @ Freq: 20 @ 500MHz
DC Resistance (DCR): 120mOhm Max
Operating Temperature: -55°C ~ 125°C
Type: Thick Film
Shielding: Unshielded
Mounting Type: Surface Mount
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Package / Case: 0201 (0603 Metric)
Tolerance: ±0.1nH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH