BSW-108-04-G-D Samtec
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 7.11 EUR |
| 100+ | 4.91 EUR |
| 500+ | 4.36 EUR |
| 1000+ | 4.24 EUR |
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Technische Details BSW-108-04-G-D Samtec
Description: CONN RCPT 16POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Breakaway, Mounting Type: Through Hole, Bottom Mount, Number of Positions: 16, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.165" (4.19mm), Insulation Height: 0.350" (8.89mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote BSW-108-04-G-D nach Preis ab 5.13 EUR bis 8.84 EUR
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BSW-108-04-G-D | Hersteller : Samtec Inc. |
 Description: CONN RCPT 16POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle, Breakaway Mounting Type: Through Hole, Bottom Mount Number of Positions: 16 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.165" (4.19mm) Insulation Height: 0.350" (8.89mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 2144 Stücke: Lieferzeit 10-14 Tag (e) |
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