Technische Details BTFW30P-3SSTE1LF AFCI
Description: CONN PLUG 30POS SMD TIN, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Plug, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.039" (1.00mm), Height Above Board: 0.295" (7.50mm), Number of Rows: 2.
Weitere Produktangebote BTFW30P-3SSTE1LF
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
| BTFW30P-3SSTE1LF | Amphenol ICC (FCI) |
Description: CONN PLUG 30POS SMD TIN Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.039" (1.00mm) Height Above Board: 0.295" (7.50mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2800 Stücke Im Einkaufswagen Stück im Wert von UAH |
| BTFW30P-3SSTE1LF |
Hersteller: Amphenol ICC (FCI)
Description: CONN PLUG 30POS SMD TIN
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Height Above Board: 0.295" (7.50mm)
Number of Rows: 2
Description: CONN PLUG 30POS SMD TIN
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Height Above Board: 0.295" (7.50mm)
Number of Rows: 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 2800 Stücke
Im Einkaufswagen
Stück im Wert von UAH