BU160Z-178HT On Shore Technology Inc.
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.28 EUR |
| 11+ | 1.94 EUR |
| 30+ | 1.8 EUR |
| 60+ | 1.71 EUR |
| 120+ | 1.63 EUR |
| 270+ | 1.54 EUR |
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Technische Details BU160Z-178HT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote BU160Z-178HT
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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BU160Z-178-HT | On Shore Technology Inc. |
 Description: CONN IC DIP SOCKET 16POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: FLASH Contact Finish - Post: Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 78.7µin (2.00µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BU160Z-178-HT |
|
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH