BU160Z-178HT On Shore Technology Inc.
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.28 EUR |
| 11+ | 1.94 EUR |
| 30+ | 1.8 EUR |
| 60+ | 1.71 EUR |
| 120+ | 1.63 EUR |
| 270+ | 1.54 EUR |
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Lieferzeit:
10-14 Tag (e)
Mindestmenge:
10 Stücke
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Technische Details BU160Z-178HT On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 78.7µin (2.00µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Copper, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass.
Weitere Produktangebote BU160Z-178HT
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
BU160Z-178-HT | On Shore Technology Inc. |
 Description: CONN IC DIP SOCKET 16POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 78.7µin (2.00µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Copper Contact Finish Thickness - Post: FLASH Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BU160Z-178-HT |
|
Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Copper
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 78.7µin (2.00µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Copper
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH