
BU64562GWZ-E2 Rohm Semiconductor

Description: 2 WIRE SERIAL INTERFACE LENS DRI
Packaging: Cut Tape (CT)
Package / Case: 8-XFBGA, CSPBGA
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 500mA
Interface: I2C
Operating Temperature: -25°C ~ 85°C
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.3V ~ 4.8V
Applications: Camera
Technology: NMOS, PMOS
Supplier Device Package: UCSP30L1
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Piezo
Part Status: Active
auf Bestellung 2988 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
4+ | 5.07 EUR |
10+ | 3.80 EUR |
25+ | 3.48 EUR |
100+ | 3.13 EUR |
250+ | 2.97 EUR |
500+ | 2.87 EUR |
1000+ | 2.78 EUR |
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Technische Details BU64562GWZ-E2 Rohm Semiconductor
Description: 2 WIRE SERIAL INTERFACE LENS DRI, Packaging: Tape & Reel (TR), Package / Case: 8-XFBGA, CSPBGA, Mounting Type: Surface Mount, Function: Driver - Fully Integrated, Control and Power Stage, Current - Output: 500mA, Interface: I2C, Operating Temperature: -25°C ~ 85°C, Output Configuration: Half Bridge (2), Voltage - Supply: 2.3V ~ 4.8V, Applications: Camera, Technology: NMOS, PMOS, Supplier Device Package: UCSP30L1, Motor Type - Stepper: Bipolar, Motor Type - AC, DC: Piezo, Part Status: Active.
Weitere Produktangebote BU64562GWZ-E2 nach Preis ab 2.68 EUR bis 5.30 EUR
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BU64562GWZ-E2 | Hersteller : ROHM Semiconductor |
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auf Bestellung 5990 Stücke: Lieferzeit 10-14 Tag (e) |
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BU64562GWZ-E2 | Hersteller : Rohm Semiconductor |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-XFBGA, CSPBGA Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 500mA Interface: I2C Operating Temperature: -25°C ~ 85°C Output Configuration: Half Bridge (2) Voltage - Supply: 2.3V ~ 4.8V Applications: Camera Technology: NMOS, PMOS Supplier Device Package: UCSP30L1 Motor Type - Stepper: Bipolar Motor Type - AC, DC: Piezo Part Status: Active |
Produkt ist nicht verfügbar |