C0816X5R0J474M050AC TDK
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Technische Details C0816X5R0J474M050AC TDK
Description: CAP CER 0.47UF 6.3V X5R 0306, Packaging: Tape & Reel (TR), Tolerance: ±20%, Features: Low ESL (Reverse Geometry), Voltage - Rated: 6.3V, Package / Case: 0306 (0816 Metric), Temperature Coefficient: X5R, Size / Dimension: 0.031" L x 0.063" W (0.80mm x 1.60mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 85°C, Applications: Bypass, Decoupling, Thickness (Max): 0.024" (0.60mm), Capacitance: 0.47 µF.
Weitere Produktangebote C0816X5R0J474M050AC
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C0816X5R0J474M050AC | Hersteller : TDK Corporation |
 Description: CAP CER 0.47UF 6.3V X5R 0306Packaging: Tape & Reel (TR) Tolerance: ±20% Features: Low ESL (Reverse Geometry) Voltage - Rated: 6.3V Package / Case: 0306 (0816 Metric) Temperature Coefficient: X5R Size / Dimension: 0.031" L x 0.063" W (0.80mm x 1.60mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 85°C Applications: Bypass, Decoupling Thickness (Max): 0.024" (0.60mm) Capacitance: 0.47 µF |
Produkt ist nicht verfügbar |
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C0816X5R0J474M050AC | Hersteller : TDK Corporation |
Description: CAP CER 0.47UF 6.3V X5R 0306 Tolerance: ±20% Features: Low ESL (Reverse Geometry) Packaging: Cut Tape (CT) Voltage - Rated: 6.3V Package / Case: 0306 (0816 Metric) Temperature Coefficient: X5R Size / Dimension: 0.031" L x 0.063" W (0.80mm x 1.60mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 85°C Applications: Bypass, Decoupling Thickness (Max): 0.024" (0.60mm) Capacitance: 0.47 µF |
Produkt ist nicht verfügbar |