C1632X5R1C105M115AC TDK Corporation
Hersteller: TDK Corporation
Description: CAP CER 1UF 16V X5R 0612
Capacitance: 1 µF
Thickness (Max): 0.051" (1.30mm)
Applications: Bypass, Decoupling
Operating Temperature: -55°C ~ 85°C
Mounting Type: Surface Mount, MLCC
Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm)
Temperature Coefficient: X5R
Package / Case: 0612 (1632 Metric)
Voltage - Rated: 16V
Features: Low ESL (Reverse Geometry)
Tolerance: ±20%
Packaging: Cut Tape (CT)
| Anzahl | Preis |
|---|---|
| 33+ | 0.55 EUR |
| 44+ | 0.4 EUR |
| 55+ | 0.32 EUR |
| 100+ | 0.29 EUR |
| 500+ | 0.23 EUR |
| 1000+ | 0.21 EUR |
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Technische Details C1632X5R1C105M115AC TDK Corporation
Description: CAP CER 1UF 16V X5R 0612, Capacitance: 1 µF, Thickness (Max): 0.051" (1.30mm), Applications: Bypass, Decoupling, Operating Temperature: -55°C ~ 85°C, Mounting Type: Surface Mount, MLCC, Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm), Temperature Coefficient: X5R, Package / Case: 0612 (1632 Metric), Voltage - Rated: 16V, Features: Low ESL (Reverse Geometry), Tolerance: ±20%, Packaging: Tape & Reel (TR).
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C1632X5R1C105M115AC | Hersteller : TDK Corporation |
Description: CAP CER 1UF 16V X5R 0612 Capacitance: 1 µF Thickness (Max): 0.051" (1.30mm) Applications: Bypass, Decoupling Operating Temperature: -55°C ~ 85°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm) Temperature Coefficient: X5R Package / Case: 0612 (1632 Metric) Voltage - Rated: 16V Features: Low ESL (Reverse Geometry) Tolerance: ±20% Packaging: Tape & Reel (TR) |
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