C1632X5R1H223M070AC TDK Corporation
Hersteller: TDK Corporation
Description: CAP CER 0.022UF 50V X5R 0612
Capacitance: 0.022 µF
Part Status: Obsolete
Thickness (Max): 0.031" (0.80mm)
Applications: Bypass, Decoupling
Operating Temperature: -55°C ~ 85°C
Mounting Type: Surface Mount, MLCC
Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm)
Temperature Coefficient: X5R
Package / Case: 0612 (1632 Metric)
Voltage - Rated: 50V
Features: Low ESL (Reverse Geometry)
Tolerance: ±20%
Packaging: Cut Tape (CT)
| Anzahl | Preis |
|---|---|
| 53+ | 0.33 EUR |
| 74+ | 0.24 EUR |
| 92+ | 0.19 EUR |
| 102+ | 0.17 EUR |
| 500+ | 0.14 EUR |
| 1000+ | 0.13 EUR |
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Technische Details C1632X5R1H223M070AC TDK Corporation
Description: CAP CER 0.022UF 50V X5R 0612, Capacitance: 0.022 µF, Part Status: Obsolete, Thickness (Max): 0.031" (0.80mm), Applications: Bypass, Decoupling, Operating Temperature: -55°C ~ 85°C, Mounting Type: Surface Mount, MLCC, Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm), Temperature Coefficient: X5R, Package / Case: 0612 (1632 Metric), Voltage - Rated: 50V, Features: Low ESL (Reverse Geometry), Tolerance: ±20%, Packaging: Tape & Reel (TR).
Weitere Produktangebote C1632X5R1H223M070AC
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C1632X5R1H223M070AC | Hersteller : TDK Corporation |
Description: CAP CER 0.022UF 50V X5R 0612 Capacitance: 0.022 µF Part Status: Obsolete Thickness (Max): 0.031" (0.80mm) Applications: Bypass, Decoupling Operating Temperature: -55°C ~ 85°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.063" L x 0.126" W (1.60mm x 3.20mm) Temperature Coefficient: X5R Package / Case: 0612 (1632 Metric) Voltage - Rated: 50V Features: Low ESL (Reverse Geometry) Tolerance: ±20% Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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C1632X5R1H223M070AC | Hersteller : TDK |
Multilayer Ceramic Capacitors MLCC - SMD/SMT C1632X5R1H223MT005N |
Produkt ist nicht verfügbar |