C3225X8R1E335M250AE TDK
auf Bestellung 1990 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 679+ | 0.22 EUR |
| 690+ | 0.21 EUR |
| 701+ | 0.20 EUR |
| 712+ | 0.19 EUR |
| 724+ | 0.18 EUR |
| 1000+ | 0.17 EUR |
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Technische Details C3225X8R1E335M250AE TDK
Description: MLCC,1210,X8R,25V,3.3F,20%,2.5MM, Tolerance: ±20%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 25V, Package / Case: 1210 (3225 Metric), Temperature Coefficient: X8R, Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 150°C, Applications: Boardflex Sensitive, Thickness (Max): 0.110" (2.80mm), Part Status: Not For New Designs, Capacitance: 3.3 µF.
Weitere Produktangebote C3225X8R1E335M250AE nach Preis ab 0.16 EUR bis 2.36 EUR
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C3225X8R1E335M250AE | Hersteller : TDK |
 Cap Ceramic 3.3uF 25V X8R 20% Pad SMD 1210 Soft Termination 150°C T/R |
auf Bestellung 1990 Stücke: Lieferzeit 14-21 Tag (e) |
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C3225X8R1E335M250AE | Hersteller : TDK |
Multilayer Ceramic Capacitors MLCC - SMD/SMT RECOMMENDED ALT 810-C3225X8R1E335KAE |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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C3225X8R1E335M250AE | Hersteller : TDK Corporation |
Description: MLCC,1210,X8R,25V,3.3F,20%,2.5MM Tolerance: ±20% Features: Soft Termination Packaging: Tape & Reel (TR) Voltage - Rated: 25V Package / Case: 1210 (3225 Metric) Temperature Coefficient: X8R Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 150°C Applications: Boardflex Sensitive Thickness (Max): 0.110" (2.80mm) Part Status: Not For New Designs Capacitance: 3.3 µF |
Produkt ist nicht verfügbar |
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C3225X8R1E335M250AE | Hersteller : TDK Corporation |
Description: MLCC,1210,X8R,25V,3.3F,20%,2.5MM Tolerance: ±20% Features: Soft Termination Packaging: Cut Tape (CT) Voltage - Rated: 25V Package / Case: 1210 (3225 Metric) Temperature Coefficient: X8R Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 150°C Applications: Boardflex Sensitive Thickness (Max): 0.110" (2.80mm) Part Status: Not For New Designs Capacitance: 3.3 µF |
Produkt ist nicht verfügbar |