CD4503BM96 Texas Instruments
Hersteller: Texas Instruments
Description: IC BUFF 3V/18V 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -55°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 18V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 14.1mA, 23mA
Supplier Device Package: 16-SOIC
Part Status: Active
| Anzahl | Preis |
|---|---|
| 2500+ | 0.45 EUR |
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Technische Details CD4503BM96 Texas Instruments
Description: IC BUFF 3V/18V 16-SOIC, Packaging: Tape & Reel (TR), Package / Case: 16-SOIC (0.154", 3.90mm Width), Output Type: Push-Pull, Mounting Type: Surface Mount, Number of Elements: 2, Logic Type: Buffer, Non-Inverting, Operating Temperature: -55°C ~ 125°C (TA), Voltage - Supply: 3V ~ 18V, Number of Bits per Element: 2, 4 (Hex), Current - Output High, Low: 14.1mA, 23mA, Supplier Device Package: 16-SOIC, Part Status: Active.
Weitere Produktangebote CD4503BM96 nach Preis ab 0.47 EUR bis 0.99 EUR
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CD4503BM96 | Hersteller : Texas Instruments |
Description: IC BUFF 3V/18V 16-SOIC Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -55°C ~ 125°C (TA) Voltage - Supply: 3V ~ 18V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 14.1mA, 23mA Supplier Device Package: 16-SOIC Part Status: Active |
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