CGA6P2X8R1E335M250AE TDK Corporation
Hersteller: TDK Corporation
Description: CAP CER 3.3UF 25V X8R 1210
Capacitance: 3.3 µF
Thickness (Max): 0.110" (2.80mm)
Ratings: AEC-Q200
Applications: Automotive, Boardflex Sensitive
Operating Temperature: -55°C ~ 150°C
Mounting Type: Surface Mount, MLCC
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Temperature Coefficient: X8R
Package / Case: 1210 (3225 Metric)
Voltage - Rated: 25V
Features: Soft Termination, High Temperature
Tolerance: ±20%
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 1000+ | 0.5 EUR |
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Technische Details CGA6P2X8R1E335M250AE TDK Corporation
Description: CAP CER 3.3UF 25V X8R 1210, Capacitance: 3.3 µF, Thickness (Max): 0.110" (2.80mm), Ratings: AEC-Q200, Applications: Automotive, Boardflex Sensitive, Operating Temperature: -55°C ~ 150°C, Mounting Type: Surface Mount, MLCC, Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm), Temperature Coefficient: X8R, Package / Case: 1210 (3225 Metric), Voltage - Rated: 25V, Features: Soft Termination, High Temperature, Tolerance: ±20%, Packaging: Tape & Reel (TR).
Weitere Produktangebote CGA6P2X8R1E335M250AE nach Preis ab 0.85 EUR bis 3.33 EUR
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CGA6P2X8R1E335M250AE | Hersteller : TDK |
Multilayer Ceramic Capacitors MLCC - SMD/SMT 3.3UF 25V 20% 1210 |
auf Bestellung 1935 Stücke: Lieferzeit 10-14 Tag (e) |
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CGA6P2X8R1E335M250AE | Hersteller : TDK Corporation |
Description: CAP CER 3.3UF 25V X8R 1210 Capacitance: 3.3 µF Thickness (Max): 0.110" (2.80mm) Ratings: AEC-Q200 Applications: Automotive, Boardflex Sensitive Operating Temperature: -55°C ~ 150°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Temperature Coefficient: X8R Package / Case: 1210 (3225 Metric) Voltage - Rated: 25V Features: Soft Termination, High Temperature Tolerance: ±20% Packaging: Cut Tape (CT) |
auf Bestellung 1980 Stücke: Lieferzeit 10-14 Tag (e) |
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