CKG45NX7T2J334M500JH TDK Corporation
Hersteller: TDK CorporationDescription: CAP CER 0.33UF 630V X7T SMD
Tolerance: ±20%
Lead Style: J-Lead
Features: Low ESL (Stacked)
Packaging: Cut Tape (CT)
Voltage - Rated: 630V
Package / Case: Stacked SMD, 2 J-Lead
Temperature Coefficient: X7T
Size / Dimension: 0.197" L x 0.138" W (5.00mm x 3.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: SMPS Filtering, Bypass, Decoupling
Thickness (Max): 0.217" (5.50mm)
Part Status: Not For New Designs
Capacitance: 0.33 µF
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.62 EUR |
| 10+ | 5.33 EUR |
| 50+ | 4.59 EUR |
| 100+ | 4.16 EUR |
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Technische Details CKG45NX7T2J334M500JH TDK Corporation
Description: CAP CER 0.33UF 630V X7T SMD, Tolerance: ±20%, Lead Style: J-Lead, Features: Low ESL (Stacked), Packaging: Tape & Reel (TR), Voltage - Rated: 630V, Package / Case: Stacked SMD, 2 J-Lead, Temperature Coefficient: X7T, Size / Dimension: 0.197" L x 0.138" W (5.00mm x 3.50mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: SMPS Filtering, Bypass, Decoupling, Thickness (Max): 0.217" (5.50mm), Part Status: Not For New Designs, Capacitance: 0.33 µF.
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CKG45NX7T2J334M500JH | Hersteller : TDK Corporation |
Description: CAP CER 0.33UF 630V X7T SMD Tolerance: ±20% Lead Style: J-Lead Features: Low ESL (Stacked) Packaging: Tape & Reel (TR) Voltage - Rated: 630V Package / Case: Stacked SMD, 2 J-Lead Temperature Coefficient: X7T Size / Dimension: 0.197" L x 0.138" W (5.00mm x 3.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: SMPS Filtering, Bypass, Decoupling Thickness (Max): 0.217" (5.50mm) Part Status: Not For New Designs Capacitance: 0.33 µF |
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