CKG45NX7T2J334M500JH TDK Corporation
Hersteller: TDK Corporation
Description: CAP CER 0.33UF 630V X7T SMD
Package / Case: Stacked SMD, 2 J-Lead
Voltage - Rated: 630V
Features: Low ESL (Stacked)
Lead Style: J-Lead
Tolerance: ±20%
Packaging: Cut Tape (CT)
Capacitance: 0.33 µF
Part Status: Not For New Designs
Thickness (Max): 0.217" (5.50mm)
Applications: SMPS Filtering, Bypass, Decoupling
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount, MLCC
Size / Dimension: 0.197" L x 0.138" W (5.00mm x 3.50mm)
Temperature Coefficient: X7T
| Anzahl | Preis |
|---|---|
| 3+ | 6.62 EUR |
| 10+ | 5.33 EUR |
| 50+ | 4.59 EUR |
| 100+ | 4.16 EUR |
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Technische Details CKG45NX7T2J334M500JH TDK Corporation
Description: CAP CER 0.33UF 630V X7T SMD, Capacitance: 0.33 µF, Part Status: Not For New Designs, Thickness (Max): 0.217" (5.50mm), Applications: SMPS Filtering, Bypass, Decoupling, Operating Temperature: -55°C ~ 125°C, Mounting Type: Surface Mount, MLCC, Size / Dimension: 0.197" L x 0.138" W (5.00mm x 3.50mm), Temperature Coefficient: X7T, Package / Case: Stacked SMD, 2 J-Lead, Voltage - Rated: 630V, Features: Low ESL (Stacked), Lead Style: J-Lead, Tolerance: ±20%, Packaging: Tape & Reel (TR).
Weitere Produktangebote CKG45NX7T2J334M500JH
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CKG45NX7T2J334M500JH | Hersteller : TDK Corporation |
Description: CAP CER 0.33UF 630V X7T SMD Capacitance: 0.33 µF Part Status: Not For New Designs Thickness (Max): 0.217" (5.50mm) Applications: SMPS Filtering, Bypass, Decoupling Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount, MLCC Size / Dimension: 0.197" L x 0.138" W (5.00mm x 3.50mm) Temperature Coefficient: X7T Package / Case: Stacked SMD, 2 J-Lead Voltage - Rated: 630V Features: Low ESL (Stacked) Lead Style: J-Lead Tolerance: ±20% Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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CKG45NX7T2J334M500JH | Hersteller : TDK |
Speciality Ceramic Capacitors CKG 1812 630V 0.33uF X7T 20% T: 5mm |
Produkt ist nicht verfügbar |