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CL21B225KOFVPJE SAMSUNGEM


cl21b225kofvpje.pdf.pdf Hersteller: SAMSUNGEM
Cap Ceramic 2.2uF 16V X7R 10% Pad SMD 0805 125C Automotive
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Technische Details CL21B225KOFVPJE SAMSUNGEM

Description: CAP CER 2.2UF 16V X7R 0805, Tolerance: ±10%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 16V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Automotive, Boardflex Sensitive, Ratings: AEC-Q200, Thickness (Max): 0.053" (1.35mm), Capacitance: 2.2 µF.

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CL21B225KOFVPJE CL21B225KOFVPJE Hersteller : Samsung Electro-Mechanics Description: CAP CER 2.2UF 16V X7R 0805
Tolerance: ±10%
Features: Soft Termination
Packaging: Tape & Reel (TR)
Voltage - Rated: 16V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive, Boardflex Sensitive
Ratings: AEC-Q200
Thickness (Max): 0.053" (1.35mm)
Capacitance: 2.2 µF
Produkt ist nicht verfügbar
CL21B225KOFVPJE CL21B225KOFVPJE Hersteller : Samsung Electro-Mechanics Description: CAP CER 2.2UF 16V X7R 0805
Tolerance: ±10%
Features: Soft Termination
Packaging: Cut Tape (CT)
Voltage - Rated: 16V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive, Boardflex Sensitive
Ratings: AEC-Q200
Thickness (Max): 0.053" (1.35mm)
Capacitance: 2.2 µF
Produkt ist nicht verfügbar