CL31B333KHHSW6E Samsung Electro-Mechanics
Hersteller: Samsung Electro-MechanicsDescription: CAP CER 0.033UF 630V X7R 1206
Tolerance: ±10%
Features: Soft Termination
Packaging: Cut Tape (CT)
Voltage - Rated: 630V
Package / Case: 1206 (3216 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Boardflex Sensitive
Thickness (Max): 0.071" (1.80mm)
Capacitance: 0.033 µF
auf Bestellung 1273 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 36+ | 0.49 EUR |
| 60+ | 0.3 EUR |
| 100+ | 0.2 EUR |
| 1000+ | 0.14 EUR |
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Technische Details CL31B333KHHSW6E Samsung Electro-Mechanics
Description: CAP CER 0.033UF 630V X7R 1206, Tolerance: ±10%, Features: Soft Termination, Packaging: Tape & Reel (TR), Voltage - Rated: 630V, Package / Case: 1206 (3216 Metric), Temperature Coefficient: X7R, Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 125°C, Applications: Boardflex Sensitive, Thickness (Max): 0.071" (1.80mm), Capacitance: 0.033 µF.
Weitere Produktangebote CL31B333KHHSW6E
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CL31B333KHHSW6E | Hersteller : Samsung Electro-Mechanics |
Description: CAP CER 0.033UF 630V X7R 1206 Tolerance: ±10% Features: Soft Termination Packaging: Tape & Reel (TR) Voltage - Rated: 630V Package / Case: 1206 (3216 Metric) Temperature Coefficient: X7R Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Boardflex Sensitive Thickness (Max): 0.071" (1.80mm) Capacitance: 0.033 µF |
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