CLM-107-02-F-D-PA Samtec
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 4.45 EUR |
| 510+ | 3.96 EUR |
| 1020+ | 3.89 EUR |
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Technische Details CLM-107-02-F-D-PA Samtec
Description: CONN RCPT 14POS 0.039 GOLD SMD, Features: Pick and Place, Packaging: Tray, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 14, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Weitere Produktangebote CLM-107-02-F-D-PA nach Preis ab 6.51 EUR bis 6.51 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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CLM-107-02-F-D-PA | Hersteller : Samtec Inc. |
 Description: CONN RCPT 14POS 0.039 GOLD SMDFeatures: Pick and Place Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 14 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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