CLM-110-02-F-D-P-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN RCPT 20POS 0.039 GOLD SMD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1500+ | 3.02 EUR |
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Technische Details CLM-110-02-F-D-P-TR Samtec Inc.
Description: CONN RCPT 20POS 0.039 GOLD SMD, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Weitere Produktangebote CLM-110-02-F-D-P-TR nach Preis ab 3.52 EUR bis 8.08 EUR
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CLM-110-02-F-D-P-TR | Hersteller : Samtec Inc. |
Description: CONN RCPT 20POS 0.039 GOLD SMD Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
auf Bestellung 6239 Stücke: Lieferzeit 10-14 Tag (e) |
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CLM-110-02-F-D-P-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
auf Bestellung 5740 Stücke: Lieferzeit 10-14 Tag (e) |
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| CLM-110-02-F-D-P-TR | Hersteller : SAMTEC |
CLM-110-02-F-D-P Board-to-board connectors |
auf Bestellung 10 Stücke: Lieferzeit 7-14 Tag (e) |
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| CLM-110-02-F-D-P-TR | Hersteller : SAMTEC |
Description: SAMTEC - CLM-110-02-F-D-P-TR - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 1mm Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 2Rows Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Steckverbindermontage: Oberflächenmontage SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 13 Stücke: Lieferzeit 14-21 Tag (e) |