| Anzahl | Privatkunde |
|---|---|
| 20+ | 8.87 EUR |
| 25+ | 8.18 EUR |
| 50+ | 7.53 EUR |
| 100+ | 6.52 EUR |
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Technische Details CLM-118-02-F-D-P Samtec
Description: CONN RCPT 36POS 0.039 GOLD SMD, Features: Pick and Place, Packaging: Tube, Connector Type: Receptacle, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 36, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Weitere Produktangebote CLM-118-02-F-D-P nach Preis ab 6.62 EUR bis 12.13 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CLM-118-02-F-D-P | Samtec |
 Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket |
auf Bestellung 124 Stücke: Lieferzeit 10-14 Tag (e) |
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CLM-118-02-F-D-P | Samtec Inc. |
Description: CONN RCPT 36POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 36 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
auf Bestellung 117 Stücke: Lieferzeit 10-14 Tag (e) |
|
| CLM-118-02-F-D-P |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket
auf Bestellung 124 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 9.2 EUR |
| 25+ | 8.59 EUR |
| 50+ | 8.08 EUR |
| 527+ | 6.62 EUR |
| CLM-118-02-F-D-P |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 36POS 0.039 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 36
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 36POS 0.039 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 36
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.13 EUR |
| 10+ | 10.31 EUR |
| 100+ | 8.76 EUR |