Produkte > SAMTEC INC. > CLM-135-02-L-D-PA

CLM-135-02-L-D-PA Samtec Inc.


clm_sm.pdf
Hersteller: Samtec Inc.
Description: CONN RCPT 70POS 0.039 GOLD SMD
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 70
Mounting Type: Surface Mount
Current Rating (Amps): 2.8A per Contact
Connector Type: Receptacle
Features: Pick and Place
Packaging: Tray
Number of Rows: 2
Row Spacing - Mating: 0.039" (1.00mm)
Insulation Height: 0.084" (2.14mm)
Part Status: Active
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Technische Details CLM-135-02-L-D-PA Samtec Inc.

Description: CONN RCPT 70POS 0.039 GOLD SMD, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 70, Mounting Type: Surface Mount, Current Rating (Amps): 2.8A per Contact, Connector Type: Receptacle, Features: Pick and Place, Packaging: Tray, Number of Rows: 2, Row Spacing - Mating: 0.039" (1.00mm), Insulation Height: 0.084" (2.14mm), Part Status: Active.

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CLM-135-02-L-D-PA CLM-135-02-L-D-PA Samtec clm_sm-2853999.pdf Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
CLM-135-02-L-D-PA clm_sm-2853999.pdf
Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH