CLP-102-02-F-DH Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 4POS 0.05 GOLD SMD R/A
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.135" (3.43mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 4
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Packaging: Bulk
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Technische Details CLP-102-02-F-DH Samtec Inc.
Description: CONN RCPT 4POS 0.05 GOLD SMD R/A, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.135" (3.43mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 4, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Bulk.
Weitere Produktangebote CLP-102-02-F-DH nach Preis ab 1.85 EUR bis 3.75 EUR
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CLP-102-02-F-DH | Hersteller : Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
auf Bestellung 87 Stücke: Lieferzeit 10-14 Tag (e) |
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