CLP-104-02-F-D-BE-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle, Bottom Entry
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 1500+ | 1.55 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details CLP-104-02-F-D-BE-TR Samtec Inc.
Description: CONN RCPT 8POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 8, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Bottom Entry, Packaging: Tape & Reel (TR).
Weitere Produktangebote CLP-104-02-F-D-BE-TR nach Preis ab 1.42 EUR bis 3.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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CLP-104-02-F-D-BE-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.05 GOLD SMDPackaging: Cut Tape (CT) Connector Type: Receptacle, Bottom Entry Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
auf Bestellung 4263 Stücke: Lieferzeit 10-14 Tag (e) |
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CLP-104-02-F-D-BE-TR | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket |
auf Bestellung 2342 Stücke: Lieferzeit 10-14 Tag (e) |
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CLP-104-02-F-D-BE-TR | SAMTEC |
Description: SAMTEC - CLP-104-02-F-D-BE-TR - Printbuchse, Einführung unten, Board-to-Board, 1.27 mm, 2 Reihe(n), 8 Kontakt(e)tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: CLP productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 125 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| CLP-104-02-F-D-BE-TR |
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Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.05 GOLD SMD
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Bottom Entry
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.05 GOLD SMD
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Bottom Entry
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
auf Bestellung 4263 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 3.1 EUR |
| 50+ | 2.62 EUR |
| 100+ | 2.2 EUR |
| 500+ | 1.8 EUR |
| CLP-104-02-F-D-BE-TR |
![]() |
Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
Headers & Wire Housings Low Profile Dual-Wipe Socket
auf Bestellung 2342 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 3.12 EUR |
| 50+ | 2.64 EUR |
| 100+ | 2.22 EUR |
| 500+ | 1.81 EUR |
| 1000+ | 1.56 EUR |
| 4500+ | 1.42 EUR |
| CLP-104-02-F-D-BE-TR |
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Hersteller: SAMTEC
Description: SAMTEC - CLP-104-02-F-D-BE-TR - Printbuchse, Einführung unten, Board-to-Board, 1.27 mm, 2 Reihe(n), 8 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (25-Jun-2025)
Description: SAMTEC - CLP-104-02-F-D-BE-TR - Printbuchse, Einführung unten, Board-to-Board, 1.27 mm, 2 Reihe(n), 8 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
usEccn: EAR99
Anzahl der Kontakte: 8Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (25-Jun-2025)
auf Bestellung 125 Stücke:
Lieferzeit 14-21 Tag (e)Im Einkaufswagen Stück im Wert von UAH


