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CLP-105-02-L-D-A-K-TR

CLP-105-02-L-D-A-K-TR Samtec Inc.

clp_sm.pdf
Hersteller: Samtec Inc.
Description: CONN RCPT 10POS 0.05 GOLD SMD
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 10
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
auf Bestellung 1375 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1375+3.26 EUR
Mindestbestellmenge: 1375 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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Produktbewertung abgeben

Technische Details CLP-105-02-L-D-A-K-TR Samtec Inc.

Description: CONN RCPT 10POS 0.05 GOLD SMD, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 10, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black.

Weitere Produktangebote CLP-105-02-L-D-A-K-TR nach Preis ab 3.08 EUR bis 6.56 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
CLP-105-02-L-D-A-K-TR CLP-105-02-L-D-A-K-TR Samtec Inc. clp_sm.pdf Description: CONN RCPT 10POS 0.05 GOLD SMD
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 10
Mounting Type: Surface Mount
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
auf Bestellung 2171 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.62 EUR
10+5.09 EUR
100+4.49 EUR
500+3.82 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
CLP-105-02-L-D-A-K-TR CLP-105-02-L-D-A-K-TR Samtec clp_1xx_xx_xxx_d_xx_xx_xx_mkt-3304497.pdf Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
1+6.56 EUR
100+4.58 EUR
500+4.05 EUR
1375+3.19 EUR
2750+3.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
CLP-105-02-L-D-A-K-TR CLP-105-02-L-D-A-K-TR SAMTEC SAMI-S-A0010445273-1.pdf?hkey=6D3A4C79FDBF58556ACFDE234799DDF0 Description: SAMTEC - CLP-105-02-L-D-A-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 10 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 10Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflachenmontage
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
CLP-105-02-L-D-A-K-TR clp_sm.pdf
CLP-105-02-L-D-A-K-TR
Hersteller: Samtec Inc.
Description: CONN RCPT 10POS 0.05 GOLD SMD
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 10
Mounting Type: Surface Mount
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
auf Bestellung 2171 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+5.62 EUR
10+5.09 EUR
100+4.49 EUR
500+3.82 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
CLP-105-02-L-D-A-K-TR clp_1xx_xx_xxx_d_xx_xx_xx_mkt-3304497.pdf
CLP-105-02-L-D-A-K-TR
Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+6.56 EUR
100+4.58 EUR
500+4.05 EUR
1375+3.19 EUR
2750+3.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
CLP-105-02-L-D-A-K-TR SAMI-S-A0010445273-1.pdf?hkey=6D3A4C79FDBF58556ACFDE234799DDF0
CLP-105-02-L-D-A-K-TR
Hersteller: SAMTEC
Description: SAMTEC - CLP-105-02-L-D-A-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 10 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 10Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflachenmontage
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 2 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH