CLP-106-02-F-S Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN RCPT 6POS 0.05 GOLD SMD
Packaging: Tube
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 6
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Number of Rows: 1
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
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Technische Details CLP-106-02-F-S Samtec Inc.
Description: CONN RCPT 6POS 0.05 GOLD SMD, Packaging: Tube, Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 6, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Number of Rows: 1, Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.00µin (0.076µm).
Weitere Produktangebote CLP-106-02-F-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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CLP-106-02-F-S | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| CLP-106-02-F-S |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH