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CLP-107-02-G-D-K-TR

CLP-107-02-G-D-K-TR Samtec Inc.

clp-1xx-xx-xxx-d-xx-xx-xx-mkt.pdf
Hersteller: Samtec Inc.
Description: CONN RCPT 14POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Tape & Reel (TR)
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1600+3.15 EUR
3200+2.67 EUR
Mindestbestellmenge: 1600 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details CLP-107-02-G-D-K-TR Samtec Inc.

Description: CONN RCPT 14POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 14, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Features: Pick and Place, Packaging: Tape & Reel (TR).

Weitere Produktangebote CLP-107-02-G-D-K-TR nach Preis ab 3 EUR bis 6.31 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
CLP-107-02-G-D-K-TR CLP-107-02-G-D-K-TR Samtec Inc. clp-1xx-xx-xxx-d-xx-xx-xx-mkt.pdf Description: CONN RCPT 14POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Cut Tape (CT)
auf Bestellung 3791 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.28 EUR
50+5.31 EUR
100+4.45 EUR
500+3.64 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
CLP-107-02-G-D-K-TR CLP-107-02-G-D-K-TR Samtec clp_sm.pdf Headers & Wire Housings Low Profile Dual-Wipe Socket
auf Bestellung 1810 Stücke:
Lieferzeit 10-14 Tag (e)
1+6.31 EUR
50+5.32 EUR
100+4.46 EUR
500+3.67 EUR
1000+3.17 EUR
1600+3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
CLP-107-02-G-D-K-TR CLP-107-02-G-D-K-TR SAMTEC clp-1xx-xx-xxx-d-xx-xx-xx-mkt.pdf Description: SAMTEC - CLP-107-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
auf Bestellung 29 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
CLP-107-02-G-D-K-TR clp-1xx-xx-xxx-d-xx-xx-xx-mkt.pdf
CLP-107-02-G-D-K-TR
Hersteller: Samtec Inc.
Description: CONN RCPT 14POS 0.05 GOLD SMD
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Height: 0.084" (2.14mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 14
Mounting Type: Surface Mount
Current Rating (Amps): 3.3A per Contact
Voltage Rating: 240VAC, 330VDC
Connector Type: Receptacle
Features: Pick and Place
Packaging: Cut Tape (CT)
auf Bestellung 3791 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.28 EUR
50+5.31 EUR
100+4.45 EUR
500+3.64 EUR
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
CLP-107-02-G-D-K-TR clp_sm.pdf
CLP-107-02-G-D-K-TR
Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
auf Bestellung 1810 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+6.31 EUR
50+5.32 EUR
100+4.46 EUR
500+3.67 EUR
1000+3.17 EUR
1600+3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
CLP-107-02-G-D-K-TR clp-1xx-xx-xxx-d-xx-xx-xx-mkt.pdf
CLP-107-02-G-D-K-TR
Hersteller: SAMTEC
Description: SAMTEC - CLP-107-02-G-D-K-TR - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbindermontage: Oberflächenmontage
Anzahl der Kontakte: 14Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Produktpalette: CLP
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
auf Bestellung 29 Stücke:
Lieferzeit 14-21 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH