CLP-108-02-F-D Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 4.77 EUR |
| 55+ | 4.03 EUR |
| 110+ | 3.38 EUR |
| 550+ | 2.76 EUR |
| 1045+ | 2.36 EUR |
| 2035+ | 2.24 EUR |
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Technische Details CLP-108-02-F-D Samtec
Description: CONN RCPT 16POS 0.05 GOLD SMD, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Packaging: Bulk, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 16, Mounting Type: Surface Mount, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.090" (2.29mm), Part Status: Active.
Weitere Produktangebote CLP-108-02-F-D nach Preis ab 2.85 EUR bis 4.91 EUR
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CLP-108-02-F-D | Hersteller : Samtec Inc. |
 Description: CONN RCPT 16POS 0.05 GOLD SMDContact Finish - Post: Tin Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Current Rating (Amps): 3.3A per Contact Voltage Rating: 240VAC, 330VDC Connector Type: Receptacle Packaging: Bulk Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 16 Mounting Type: Surface Mount Number of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Insulation Height: 0.090" (2.29mm) Part Status: Active |
auf Bestellung 1612 Stücke: Lieferzeit 10-14 Tag (e) |
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