Technische Details CLP-108-02-G-D-PA Samtec
Description: CONN RCPT 16POS 0.05 GOLD SMD, Number of Rows: 2, Row Spacing - Mating: 0.050" (1.27mm), Insulation Height: 0.084" (2.14mm), Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 16, Mounting Type: Surface Mount, Current Rating (Amps): 3.3A per Contact, Voltage Rating: 240VAC, 330VDC, Connector Type: Receptacle, Features: Pick and Place, Packaging: Tray.
Weitere Produktangebote CLP-108-02-G-D-PA nach Preis ab 7.09 EUR bis 8.85 EUR
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CLP-108-02-G-D-PA | Hersteller : Samtec Inc. |
 Description: CONN RCPT 16POS 0.05 GOLD SMDNumber of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Insulation Height: 0.084" (2.14mm) Contact Finish - Post: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 16 Mounting Type: Surface Mount Current Rating (Amps): 3.3A per Contact Voltage Rating: 240VAC, 330VDC Connector Type: Receptacle Features: Pick and Place Packaging: Tray |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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