Technische Details CLP-108-02-L-DH Samtec
Description: CONN RCPT 16P 0.05 GOLD SMD R/A, Packaging: Tube, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 16, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Insulation Height: 0.135" (3.43mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote CLP-108-02-L-DH nach Preis ab 4.9 EUR bis 6.64 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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CLP-108-02-L-DH | Samtec |
 Headers & Wire Housings Low Profile Dual-Wipe Socket |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| CLP-108-02-L-DH |
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Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket
Headers & Wire Housings Low Profile Dual-Wipe Socket
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.64 EUR |
| 25+ | 5.71 EUR |
| 55+ | 5.4 EUR |
| 550+ | 4.9 EUR |