CLP-110-02-F-D-BE Samtec Inc.
Hersteller: Samtec Inc.Description: CONN RCPT 20POS 0.05 GOLD SMD
Packaging: Tube
Connector Type: Receptacle, Bottom Entry
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
auf Bestellung 972 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.78 EUR |
| 10+ | 7.97 EUR |
| 100+ | 7.03 EUR |
| 500+ | 5.97 EUR |
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Technische Details CLP-110-02-F-D-BE Samtec Inc.
Description: CONN RCPT 20POS 0.05 GOLD SMD, Packaging: Tube, Connector Type: Receptacle, Bottom Entry, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote CLP-110-02-F-D-BE nach Preis ab 2.96 EUR bis 8.84 EUR
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Description: SAMTEC - CLP-110-02-F-D-BE - Printbuchse, Einführung unten, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: CLP productTraceability: No Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (21-Jan-2025) |
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