Technische Details CLP-110-02-F-D-K Samtec
Description: CONN RCPT 20POS 0.05 GOLD SMD, Features: Pick and Place, Packaging: Tube, Connector Type: Receptacle, Voltage Rating: 240VAC, 330VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote CLP-110-02-F-D-K nach Preis ab 5.26 EUR bis 10.22 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CLP-110-02-F-D-K | Samtec Inc. |
 Description: CONN RCPT 20POS 0.05 GOLD SMDFeatures: Pick and Place Packaging: Tube Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
auf Bestellung 99 Stücke: Lieferzeit 10-14 Tag (e) |
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CLP-110-02-F-D-K | Samtec |
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch |
auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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CLP-110-02-F-D-K | SAMTEC |
Description: SAMTEC - CLP-110-02-F-D-K - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, CLP tariffCode: 85366930 productTraceability: No Kontaktüberzug: Hauchvergoldete Kontakte rohsCompliant: YES Rastermaß: 1.27mm Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Steckverbindermontage: Oberflächenmontage Produktpalette: CLP SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 17 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| CLP-110-02-F-D-K |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 20POS 0.05 GOLD SMD
Features: Pick and Place
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.06 EUR |
| 10+ | 9.14 EUR |
| CLP-110-02-F-D-K |
|
Hersteller: Samtec
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
Headers & Wire Housings Low Profile Dual-Wipe Socket, .050" Pitch
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 10.22 EUR |
| 10+ | 8.77 EUR |
| 88+ | 7.47 EUR |
| 264+ | 7.16 EUR |
| 528+ | 6.5 EUR |
| 1012+ | 5.26 EUR |
| CLP-110-02-F-D-K |
|
Hersteller: SAMTEC
Description: SAMTEC - CLP-110-02-F-D-K - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflächenmontage
Produktpalette: CLP
SVHC: No SVHC (25-Jun-2025)
Description: SAMTEC - CLP-110-02-F-D-K - Printbuchse, Board-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, CLP
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Hauchvergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1.27mm
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflächenmontage
Produktpalette: CLP
SVHC: No SVHC (25-Jun-2025)
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)